Internal material and assembly analysis
This activity consists of analyzing the constituents of a component in order to evaluate its manufacturing quality. After opening the component or performing a microsection, the analysis will make it possible to determine the markings on the chip, the conformity of the assembly of the die and the wire bondings, etc.
This analysis, in coordination with an electrical characterization, provides information for the qualification of a component. Beyond semiconductors, this analysis is also carried out on passive components and electromechanical components to anticipate their behavior over time or their compatibility with a specific process.