The purpose of construction analysis is to study the elements of a component in order to evaluate its manufacturing quality.
After opening the component or a microsection, the analyses performed will determine the markings on the chip, the conformity of the chip assembly and bondings, the characteristics of the chip, and more.
This construction analysis, accompanied by an electrical characterization, provides the information necessary for the qualification of a component. In addition to semiconductors, this analysis is also performed on passive and electromechanical components to anticipate their behavior over time or their compatibility with a specific process.
The analysis of components in the early stages of a project makes it possible to establish a reference benchmark to verify the evolution of a product during its life cycle.