Component suppliers care about the quality of their components, and are keen to meet the expectations of all their customers, including the most demanding ones, by guaranteeing the quality of their electronic components...
Tame-Component's expertise
Tame-Component offers a range of services to ensure that components meet their customers’ needs.
Our main goal is to determine whether components comply with the client's specification sheet and thus to eliminate all non-compliant components.
Thanks to our wealth of experience as a recognised laboratory and industrial reference, as well as an array of accreditations and certifications, you can be guaranteed that Tame-Component is the trusted partner you need to allow you to fully focus on your core business.
Certifications and accreditations
Quality has been at the heart of Tame Component’s concerns since the beginning. In a context of continuous improvement, the laboratory is well aware that certifications and accreditations have become an essential requirement to guarantee the quality of its processes. Thus, Tame-Component has developed its skills and adapted its organization to obtain the following certifications:
- Internal visual inspection: determination of internal defects of a component, according to MIL_-STD-883, METHOD 2013
- External visual inspection: determination of external defects of a component, according to MIL_-STD-883, METHOD 2009
- Bond pull-out test: Tensile stress on chip bondings, according to MIL_-STD-883, METHOD 2011
- Chip shear test: force exerted on the chips, according to MIL_-STD-883, METHOD 2019
COFRAC Accreditation 
The accreditation granted by COFRAC to Tame-Component covers the following types of tests
- Counterfeit detection: external visual inspection, X-ray, electrical test, wettability, internal visual inspection, according to a proprietary know-how
- Wettability of component legs: measurement by wetting balance according to IPC/ECA J-STD-002, METHODS E, F, E1 and F1
- Chemical opening: attack of plastic materials (coating) by chemical preparation, according to proprietary know-how
- Internal visual inspection: determination of internal defects of a component, according to MIL_-STD-883, METHOD 2013
- External visual inspection: determination of external defects of a component, according to MIL_-STD-883, METHOD 2009
- Bond pull-out test: Tensile stress on chip bondings, according to MIL_-STD-883, METHOD 2011
- Chip shear: force applied to chip bonding, per MIL_-STD-883, METHOD 2019