The purpose of materials analysis is to characterise materials and identify their mechanical, thermal or metallurgical properties.
PartLab opens new doors for Tame-Component thanks to ELEMCA's expertise and technical capabilities in materials analysis.
What is materials analysis?
Tame-Component expands its catalog of services in partnership with ELEMCA to support your design choices, verify the compliance of materials used with the main standards or customer specifications or determine a likely origin of a failure: physical or metallurgical alteration, contamination ...
Physical and chemical analysis gives access to the characteristics of structures and materials and enables you to determine failure mechanisms or design and production choices:
- Failure analysis: characterisation of a pre-localized defect
- Reverse engineering or microelectronic process control
- Verification of assembly quality: integrity of soldered joints
- Mechanical damage: analysis of the fracture surface or material alteration
These physical analyses, at the core or on the surface, can be applied to a number of technologies:
- Printed circuit boards
- Components (individual or on wafer)
- Mechanical parts or assemblies
Many materials undergo changes in their thermomechanical properties during heating or cooling.
The aim of thermomechanical analysis is to provide information about the composition, structure, production conditions or application possibilities of different materials.
The applications of this type of analysis are multiple:
- Materials selection: characterisation and comparison of characteristic properties on different references
- Digital simulation: implementation of mechanical, thermal or electrical properties in a calculation model
- Process optimization: correlating the material's microstructure with its mechanical or thermal behavior
- Failure analysis: highlighting anomalies or deviations in behavior
These multi-physics analyses can be applied to many different materials:
- All types of polymers, such as coating or encapsulation resin
- Printed circuitry
- Tropicalization varnishes
- Semiconductor materials, metal and ceramic parts
Knowledge of a material’s microstructure is a key parameter.
There is a close link between a material’s properties, its structural morphology and its use.
Different techniques allow this microstructure to be determined and studied.
Tame-Component, using ELEMCA’s SEM-EBSD detector, analyzes the microstructure of crystalline materials and metals: electronic solder, leaded or not.
Other analyses, by optical inspection, can then be carried out:
- under bright field after revelation by chemical etching
- through differential interference contrast
These microstructural analyses are used in complement to preliminary SEM inspections.
These analyses have concrete applications:
- Failure analysis: identification of the metallurgical phenomena at the origin of a damage
- R&D: determination of metallurgical aging mechanisms and their kinetics
They allow us to analyze the microstructure of electronic solder alloys as well as other various materials: